Semiconductor Technology & Nanoelectronics
Semiconductor chips consist of a series of thin films that have been patterned to produce electronic devices. The use of surface analysis instruments to characterize the composition of thin films or patterned structures and detect contaminants or process residues is critical to the development of new materials, manufacturing processes, and increasing product yield. Early defect identification saves money and time. Nanomechanical testing routines are the new standard for future materials development and improved product life time.
Measuring Full Wafer Surface Composition Maps
Characterizing Bumped Wafers and determining Solder Ball Surface Chemistry
AES Depth Profiling of a P Doped Si Nanowire and defect navigation on wafer pieces with the PHI 700 Auger Nanoprobe.
3D IMAGING of a CMOS Device and quantitative analysis of topographic effects on conductive surfaces
Multilayer films are analyzed by examining at their cross-sections. Using the AFM-IR technique, high-spatial resolution spectroscopic data in the mid-infrared range can be obtained while preserving the ordering of the layers within the film.
Characterizing Electrically Isolated Bond Pads with the PHI 700Xi
AES Depth Profiling of P Doped Si Nanowire
Direct Measurement of Inhomogeneous Longitudinal Dopant Distribution in SiNWs
Characterizing Bumped Wafers with the Quantera SXM
Thermal Expansion Study in a TSV-Structure
Industry Solutions Semiconductor Packaging