X-Perience in Future Product Development & Innovation

Semiconductor Technology & Nanoelectronics

Semiconductor chips consist of a series of thin films that have been patterned to produce electronic devices. The use of surface analysis instruments to characterize the composition of thin films or patterned structures and detect contaminants or process residues is critical to the development of new materials, manufacturing processes, and increasing product yield. Early defect identification saves money and time. Nanomechanical testing routines are the new standard for future materials development and improved product life time.

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PHI -VersaProbe II Scanning XPS
Measuring Full Wafer Surface Composition Maps
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PHI -Quantera II Scanning XPS
Characterizing Bumped Wafers and determining Solder Ball Surface Chemistry

 

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PHI-710 Scanning Auger Nanoprobe
AES Depth Profiling of a P Doped Si Nanowire and defect navigation on wafer pieces with the PHI 700 Auger Nanoprobe.
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PHI TRIFT V nanoTOF
3D IMAGING of a CMOS Device and quantitative analysis of topographic effects on conductive surfaces

 

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AI-nanoIR
Multilayer films are analyzed by examining at their cross-sections. Using the AFM-IR technique, high-spatial resolution spectroscopic data in the mid-infrared range can be obtained while preserving the ordering of the layers within the film.

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Microelectromechanical systems (MEMS)
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Defect Identification

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Bond Pad Surface Composition
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Industry Solutions: Semiconductor Packaging

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Surface Science –
Physical Electronics

AES Depth Profiling of P Doped Si Nanowire

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download_noun_project_21324
Surface Science –
Physical Electronics

Characterizing Bumped Wafers with the Quantera SXM

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Nanomechanical Testing –
Hysitron Inc.
Thermal Expansion Study in a TSV-Structure
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Nanomechanical Testing –
Hysitron Inc.

Industry Solutions Semiconductor Packaging