Products for Surface Analysis

Different methods are available for surface analysis.

X-ray Photoelectron Spectroscopy (XPS) also known as Electron Spectroscopy for Chemical Analysis (ESCA) is the most widely used surface analysis technique because it can be applied to a broad range of materials and provides valuable quantitative and chemical state information from the surface of the material being studied. The average depth of analysis for an XPS measurement is approximately 5 nm.

Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) provides elemental, chemical state, and molecular information from surfaces of solid materials. The average depth of analysis for a TOF-SIMS measurement is approximately 1 nm.

Auger Electron Spectroscopy (AES) provides quantitative elemental and chemical state information from surfaces of solid materials. The average depth of analysis for an AES measurement is approximately 5 nm.

X-ray Photoelectron Spectroscopy (XPS)

The information XPS provides about surface layers or thin film structures is important for many industrial and research applications where surface or thin film composition plays a critical role in performance including: nanomaterials, photovoltaics, catalysis, corrosion, adhesion, electronic devices and packaging, magnetic media, display technology, surface treatments, and thin film coatings used for numerous applications.

XPS is typically accomplished by exciting a samples surface with mono-energetic Al kα or Cr kα x-rays (HAXPES) causing photoelectrons to be emitted from the sample surface. An electron energy analyzer is used to measure the energy of the emitted photoelectrons. From the binding energy and intensity of a photoelectron peak, the elemental identity, chemical state, and quantity of a detected element can be determined.

  • PHI Genesis – XPS and HAXPES combined in an automated multi-technology platform
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Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS)

TOF-SIMS surface analysis equipment provides elemental, chemical and molecular information by measuring the mass of ions that have been ejected from a samples surface with the use of a focused ion beam.

  • PHI nanoTOFIII can be configured with a wide variety of options to optimize performance for organic materials, inorganic materials, or both, depending on customer requirements.
  • The superior performance patented TRIFT analyzer realized improvement of product performance and manage process control.
  • Parallel Imaging MS/MS – NEW! Changing TOF-SIMS from I Think to I know!
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Auger electron spectroscopy (AES)

AES surface analysis equipment provides elemental and in some instances chemical information with the use of a finely focused electron beam to excite the Auger electrons. The analysis of submicron features is routine and thin film analysis is possible with the use of a sputter ion gun to remove material.

  • PHI 710 Scanning Auger Nanoprobe provides high performance Auger (AES) Spectral Analysis, Auger imaging, and sputter depth profiling of complex materials.
  • The PHI 710 is the only Auger with a CMA Analyzer. The CMA enables our customers to analyze “real world”, topographical samples.
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Physical Electronics GmbH
Salzstraße 8
85622 Feldkirchen near Munich

Telephone: +49 89 96275 0

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